PART |
Description |
Maker |
04306-4 04306 |
HEATSINK, HORIZONTAL MINI MOD
|
VICOR[Vicor Corporation]
|
1-87247-9 |
HEADR ASSEMBLY, MOD I, VERTICAL, SINGLE ROW
|
Tyco Electronics
|
102100-1 |
.156 Inch Centerline-Cable to Board AMPMODU .031 x .062 Interconnection System (Mod I); MOD I RECP PLTD 15 SEL ( AMP )
|
Tyco Electronics
|
2SC5180 |
ECONOLINE: RY & RX - Controllable Output- 1kVDC Isolation- No Heatsink Required- UL94V-0 Package Material- Toroidal Magnetics- No External Components- Fully Encapsulated- Efficiency to 70% NPN EPITAXIAL SILICON TRANSISTOR IN SUPER MINI-MOLD PACKAGE FOR LOW-NOISE MICROWAVE AMPLIFICATION
|
NEC Corp. NEC[NEC]
|
0039299024 39-29-9024 5566-02B2GS |
4.20mm (.165) Pitch Mini-Fit Jr. Header, Dual Row, Vertical, with Snap-in Plastic 4.20mm (.165) Pitch Mini-Fit Jr. Header, Dual Row, Vertical, with Snap-in Plastic Selective Plating, with Drain Holes
|
Molex Electronics Ltd.
|
0366330038 36633-0038 |
4.20mm (.165) Mini-Fit Jr. Header, Vertical, Nylon, without Flange, 14Circuits
|
Molex Electronics Ltd.
|
36633-0036 |
4.20mm (.165) Mini-Fit Jr. Header, Vertical, Nylon, without Flange, 8 Circuits
|
Molex Electronics Ltd.
|
0366330028 36633-0028 |
4.20mm (.165) Mini-Fit Jr. Header, Vertical, Nylon, without Flange, 22Circuits
|
Molex Electronics Ltd.
|
STK15C88 STK15C88-N25 STK15C88-N25I STK15C88-N35 S |
HEATSINK TO-220 DUAL MT W/CLIPS 32K的8自动存储非易失高性能CMOS非易失性静态随机存储器 HEATSINK TO-218 10W H=2.5 BLK 32K的8自动存储非易失高性能CMOS非易失性静态随机存储器 HEAT SINK .720 HIGH RISE TO-220 32K的8自动存储非易失高性能CMOS非易失性静态随机存储器 32K x 8 AutoStore nvSRAM High Performance CMOS Nonvolatile Static RAM 32K的8自动存储非易失高性能CMOS非易失性静态随机存储器
|
Electronic Theatre Controls, Inc. List of Unclassifed Manufacturers ETC[ETC] SIMTEK
|